Preface The customer used MCSDK 5.4.8 to generate code for a Hall sensor, but when the motor had a load during startup, there was a magnetic excitation noise. However, there were no additions to the code, only a motor stop and restart. We used the DAC interface for easy debugging and ultimately identified algorithmic adjustments […]
ST Motor Control Use Case and Debug Read More »
Preface Meridian offers advanced CMOS thermal imaging solutions, enabling the production of thermal image sensors that can receive infrared wavelengths ranging from 8 to 14 μm. These sensors are primarily applied in consumer and commercial products. What sets them apart from conventional imaging is their affordability, as they require only a low-cost MCU to handle
MERIDIAN Thermal Imager Sensor(STM32) Read More »
Preface The customer requires encryption protection for certain devices. ST offers two options: Directory Structure of V4 vs. Directory Structure of V3 The directory structure of the V3 software package corresponds to a separate directory for each STM32 series. The directory structure of V4 is fully compatible with the Cube/X-Cube software package (STM32CubeXX / X-Cube-XXX)
STM32 Cryptographic Software Package Read More »
Preface FDCAN (Flexible Data-Rate CAN) is an upgraded version of CAN. Its features include: FDCAN Format Frame architecture comparison between CAN-FD and CAN 2.0 After identifier, CAN 2.0 and CAN-FD have a different action: Main differences between CAN-FD and CAN 2.0 STM32CubeMX Setting You can refer to the H7 configuration options available online. When using
STM32 FDCAN Introduction difference CAN lib Read More »
Preface Unlike traditional IR sensors, the VL53L5CX utilizes ST’s latest generation of direct Time-of-Flight (ToF) technology, allowing for absolute distance measurement regardless of target color or reflectivity. It provides accurate ranging up to 400 cm and operates at high speed (60 Hz), making it the fastest multi-zone miniature ToF sensor available on the market. Hardware
VL53L5CX coding structure on STM32 Read More »
Preface Recently, due to a requirement, we need to assist the customer in displaying a thermal camera on the MCU STM32H7 display panel using the STM32H750-DK development board. However, the display panel used in this development board is not SPI-driven, so we have to start learning LTDC+DMA2D. This section will introduce the usage and overview
How to use DMA2D on STM32H7 Read More »
Preface ST has introduced two software packages, STM32CubeAI and NanoEdge AI Studio, targeting different user groups. Here, we will provide an initial introduction and usage guide for STM32CubeAI.(STM32CubeAI is currently integrated into the X-Cube-AI software package under STM32CubeMX. Please note that STM32CubeAI only facilitates the conversion of third-party software and does not automatically generate AI
How to use STM32CubeAI on STM32CubeMX Read More »
Preface Due to the limited support for Flash models in STM32CubeProgrammer, only a partial range of MCU and Flash models can be covered, which cannot fully meet the customer’s needs. Therefore, an external Flash loader can be created using stm32CubeMX. Customers can customize the generation according to their own models. Here, Discovery STM32H750XB is used
Discovery STM32H750XB-External Loader Read More »
Preface The STM32 microcontroller has an internal temperature sensor. The sensor is very rough (±1.5 °C) and is connected internally to one of the ADC channels, making it possible to easily obtain device temperature without the need for any additional components. However, please note that this temperature is a relative temperature, not an absolute temperature,
Internal Temperature Sensor On STM32 Read More »
IAP Preface IAP (In Application Programming) refers to the process of programming a portion of the User Flash during the runtime of a program. The purpose is to facilitate the update and upgrade of firmware programs in the product through a reserved communication port after the product has been released. IAP Flow Here we will
STM32 USB_Device IAP practice Read More »
